NAND flash technology is on a roll with advancements in cell structure and the subsequent boost in storage density. That allows this non-volatile-memory (NVM) chip to deliver faster throughput and ...
Check out our coverage of the 2023 Flash Memory Summit. 3D NAND chips are the skyscrapers of the semiconductor industry, linking together layers of flash memory with short vertical interconnects that ...
Researchers find a faster way to etch deep holes for 3D NAND Plasma-based cryo-etching technique doubles etch speed, improving efficiency Faster etching might mean cheaper storage, but real-world ...
For several decades, NAND Flash has been the primary technology for low-cost and large-density data storage applications. This non-volatile memory is present in all major electronic end-use markets, ...
Companies Preview 10 th Generation 3D Flash Memory Technology Setting A New Benchmark for Performance, Power Efficiency and Bit Density SAN FRANCISCO--(BUSINESS WIRE)--Kioxia Corporation and Sandisk ...
Why it matters: Western Digital dropped a bombshell during a recent investor presentation. The storage giant has teased the world's first 2Tb 3D quad-level cell NAND flash memory die. The chip dwarfs ...
Vertical scaling is vital to increasing the storage density of 3D NAND. According to imec, airgap integration and charge trap layer separation are the keys to unlocking it. Inside the charge trap cell ...
System memory is a complex problem. More memory means more performance, especially in a virtualized environment. But more memory also requires more power, and that can add up as you start to get into ...
An industry expert forecasts that the NAND memory market will grow in 2025, driven by Solid-State Devices and smartphones. Industry experts expect NAND memory manufacturers to increase CapEx in 2025, ...
NAND Flash is a type of non-volatile memory technology that has revolutionized data storage in the digital age. It is a form of flash memory, which means it can be electrically erased and reprogrammed ...
SK hynix is showing off a sample of its 321-layer 1-terabit (Tb) triple-level cell (TLC) "4D" NAND chips, which is notable because it's the first time a chip maker has stacked over 300 layers of NAND ...