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Abstract: Analyzed the overall system reliability by coupling the effects of multi-physical field conditions. Proposed a method of finite element multi-physical fields whole-process analysis for ...

Increasing electronic packaging density leads to a greater need for precise thermal management. Hence, for electrical ...

Abstract: This article focuses on the formation of the voids inside the solder joints during reflow soldering in surface mount technology (SMT). The stencil printing technology is commonly used during ...