Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...
PCB-based packaging for GaN power devices and modules is the subject of a UK government-funded consortium that will develop both technology and an all-UK GaN module supply-chain. The project, ...
As a designer of High Frequency Radio equipment for over 40 years, I found difficulties in sufficiently isolating one stage of a radio system from another, this can cause interference between adjacent ...
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