Abstract: We propose a novel physical model for the attempt-to-escape frequency of trap-to-band electron emission, which is broadly applicable to various trap-to-band scenarios. The model is verified ...
IBM's next-gen FlashSystem storage arrays combine agentic AI, hardware-native ransomware detection, and record capacity for ...
Behind the investor interest is a highly specialized component: electrostatic chucks, or ESCs, used in semiconductor etch ...
However, sTIMs cannot be used alone, they require backside metallization (BSM) on the module to establish a thermal path and ...
Because permeation and plasma-induced degradation are continuous rather than episodic, their effects accumulate gradually.
US equity valuations remain elevated, and concentration risk is now at a decade-high, driven by a narrow group of mega-cap technology stocks. Read more here.
Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.
Southeast Asia and India will likely emerge as volume-based back-end assembly and test hubs, specializing in select areas of the back-end processes.
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