The lapping process involves thinning wafers from the back with a rotating abrasive surface. It is important to receive precise feedback as the process is carried out to monitor the quantity of ...

Some users are reporting that they are seeing DISM Host servicing process (DismHost.exe) high CPU, disk, and memory usage which is impacting other processes. In this guide, we have a few fixes that ...

DISCO Corporation has developed a KABRA ingot slicing method specially optimised for the production of GaN wafers. In the KABRA process (shown above), a separation layer (KABRA layer) is formed at a ...

Abstract: In response to the lack of on-line monitoring of process stability in the traditional lapping process, the limit device of the workpiece was retrofitted to reflect the process stability in ...

SiC, a semiconductor compound consisting of silicon and carbon, belongs to the wide-bandgap family of materials. Its physical bond is very strong, giving the semiconductor a high mechanical, chemical, ...

The lapping and polishing of wafers used to manufacture semiconductors and optical devices is a time consuming task that can risk damage to expensive custom wafers worth in excess of (USD) $5,000 each ...

Logitech describes key advantages of its new LP70 multi-station automated lapping and polishing system that can dramatically increase overall wafer productivity by 40 percent for almost all substrate ...