Copper wire bonding is an essential interconnection technology in microelectronic packaging, offering a cost-effective alternative to gold while delivering superior electrical and thermal ...

Copper-copper bonding is emerging as a pivotal technology in three-dimensional integration, offering a viable pathway towards overcoming the limitations of traditional interconnect methods.

Manufacturers and construction companies — as well as consumers — would face higher prices if the U.S. jacks up tariffs on copper, analysts said.

Recently, copper wires have been attracting much attention for LSI (Large Scale Integration) bonding because of its excellent mechanical and electrical properties, and low material cost. On the other ...

In the context of 3D hybrid bonding architectures, ensuring the flatness of metallic pads before bonding is critical. The control of this flatness is important and the dimension to be measured is very ...