NINGBO, ZHEJIANG PROVINCE, CHINA, January 19, 2026 /EINPresswire.com/ -- In recent years, the global healthcare ...
Want to take your digital art to the next level by blending 3D objects seamlessly into 2D environments using Photoshop? This step-by-step tutorial will teach you exactly how to import, position, and ...
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Must-try 3D AI platform (Meshy 5 tutorial)
Sponsored by Meshy. Unlock the fastest path from idea to 3D model with Meshy AI 5! In this Blue Lighting tutorial, we walk you through creating stunning, professional-quality 3D objects in just a few ...
To date, the department’s specialists have scanned about 15 standard product types and are now ready to disseminate the experience of using 3D scanning technology across the entire plant and conduct ...
Not every laptop purchase is about chasing premium specs. Sometimes you just want something reliable for work, school, and ...
That's today's project. In this article, I'll show you how I started with a picture of me, used some intermediate AI, and turned it into a physical 3D plastic me figurine. Do I need a me figurine? No.
Like all AI models based on the Transformer architecture, the large language models (LLMs) that underpin today’s coding ...
X-ray tomography is a powerful tool that enables scientists and engineers to peer inside of objects in 3D, including computer ...
How KISTERS 3DViewStation supports the digital thread – cost-conscious, time-saving, and flexible SAN ANTONIO, TX, UNITED STATES, January 6, 2026 /EINPresswire.com/ — Manufacturing companies are under ...
Learn more about whether Trimble Inc. or Unity Software Inc. is a better investment based on AAII's A+ Investor grades, which compare both companies' key financial metrics.
Thermal Modeling in Emerging Heterogeneous 2.5D/3D Systems (EPFL, Universidad Complutense de Madrid)
A new technical paper titled “3D-ICE 4.0: Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and Universidad Complutense de Madrid.
As three-dimensional integrated circuit (3D-IC) technology becomes the architectural backbone of AI, high-performance computing (HPC), and advanced edge systems, thermal management has shifted from a ...
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