According to the latest memory semiconductor figures released by market research firm Counterpoint Research on Sept. 24, SK hynix led the HBM market in the second quarter with a 62% market share.
But to make use of those technologies, the firms that design chips are increasingly relying on AI-powered software from providers such as Cadence Design Systems (CDNS.O) and Synopsys , both of which ...
As TSMCs 2nm mass production countdown begins, speculation mounts over its major clients. KLA, a key chipmaking equipment supplier, reports that around 15 customers are designing at the N2 node, ...
OpenAI and NVIDIA today announced a letter of intent for a landmark strategic partnership to deploy at least 10 gigawatts of NVIDIA systems for OpenAI's next-generation AI infrastructure to train and ...
In the article, CEO Jaehong Park not only introduces Eagle-N, but also shares insights on the broader industry landscape and BOS’s vision to shape the future of automotive AI. From cutting-edge NPU ...
NanoEdge AI Studio v5 is the first AutoML tool for STM32 microcontrollers capable of generating anomaly data out of typical logs, thanks to a new feature we call Synthetic Data Generation.
Breakthrough Gen3 UCIe IP subsystem achieves 64 Gbps per-I/O pin data rates and doubles shoreline bandwidth density, enabling scalable XPUs, and data center chiplet architectures with TSMC's 3nm ...
proteanTecs Hardware Monitoring System has been integrated into a customer test chip, targeted to high-performance markets. Silicon samples have been delivered and extensive bring-up and ...
Cadence’s AI design flows support TSMC’s N2 and A16 ™ technologies; Cadence 3D-IC solutions provide comprehensive support for latest TSMC 3DFa ...
Hsinchu, Taiwan – September 25, 2025 – M31 Technology Corporation (M31), a leading silicon intellectual property (IP) provider, today announced its latest Ultra-Low Leakage (ULL), Extreme Low Leakage ...
Hsinchu, Taiwan, September 25, 2025-- eMemory, the world’s leading provider of embedded non-volatile memory (eNVM) and security IP, has been selected as the 2025 TSMC Open Innovation Platform ® (OIP) ...
Our longstanding relationship with TSMC underscores the transformative power of collaborative innovation,” said Mike Ellow, CEO, Siemens EDA, Siemens Digital Industries Software. “By combining Siemens ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback