IEEE

Multi-Scale Thermal Modeling of 3D-Heterogeneous Integrated Processing-Near-Memory Chip for Edge Large Language Model Inference

Abstract: In this paper, we demonstrated a multi-scale thermal modeling work for 3D-heterogeneous integrated processing-near-memory (PNM) chips. To achieve this, We extracted thermal conductivity ...
Semiconductor Engineering

First Forays Into True 3D-IC Designs

Risk is high for pioneers of chiplet stacking, but the rewards could be significant. This will get easier, though.
GitHub

uqlm: Uncertainty Quantification for Language Models

UQLM provides a suite of response-level scorers for quantifying the uncertainty of Large Language Model (LLM) outputs. Each scorer returns a confidence score between 0 and 1, where higher scores ...
IEEE

Physical Adversarial Examples for Person Detectors in Thermal Images Based on 3D Modeling

Abstract: Thermal Infrared detection is widely used in autonomous driving, medical AI, etc., but its security has only attracted attention recently. We propose infrared adversarial clothing designed ...