New integration and patterning schemes used in 3D memory and logic devices have created manufacturing and yield challenges. Industrial focus has shifted from the scaling of predictable unit processes ...

LONDON--(BUSINESS WIRE)--Process Systems Enterprise (PSE), a Siemens business, today released its rebranded gPROMS Process advanced process modelling environment. Formerly known as gPROMS ...

The researchers explore the optimization and integrated application of artificial intelligence (AI) in the manufacturing of ...

Nowadays, to have the edge over competitors, modern manufacturing automation systems have to be employed. They consist of Information Technology (IT) and control systems at business and process levels ...

Advanced CMOS scaling and new memory technologies have introduced increasingly complex structures into the device manufacturing process. For example, the increase in NAND memory layers has achieved ...

Multifidelity optimization can inform decision-making during process development and reduce the number of experiments ...

Comprehensive process optimization begins with an evaluation to identify the best combination of tooling, fixturing, machines, and cycle times. The Seco Engineered Solutions team evaluates the scope ...

San Jose, Calif. — The addition of nonvolatile memory to a system-level IC is never an easy proposition. Often, design teams take the easy way out and simply put flash in an external chip. If ...

InstaLOD 2026 simplifies and scales 3D asset preparation, helping teams move from source data to production-ready ...