Abstract: 64Mp CIS with 0.5um pixels has been developed with three wafer layers (e.g. top-wafer for PDs and TG TRs, mid-wafer for pixel TRs, and bottom-wafer for the analog and logic circuits). The ...
Imaging technology has transformed how we observe the universe—from mapping distant galaxies with radio telescope arrays to ...
This device from SwitchBot measures temperature, humidity, carbon dioxide levels and more to keep my home safe during the ...
Abstract: Vision-based tactile sensors have drawn increasing interest in the robotics community. However, traditional lens-based designs impose minimum thickness constraints on these sensors, limiting ...
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