The proportion of sales to non-volatile memory ... PORs in NAND slit etching process which drove sales growth and demand for etch system grew in interconnect process of advanced packaging for ...

Powertech Technology (PTI), a Taiwanese memory packaging and testing vendor, experienced a decrease in solid-state drive (SSD) and NAND flash shipments in the first ...

Czech-based electron microscope manufacturer TESCAN is undergoing a strategic shift, expanding into advanced semiconductor ...

Intel asserts it is the industry leader in packaging technologies for semiconductors, which today have expanded capabilities ...

Embedded Multi-die Interconnect Bridge-T (EMIB-T) was a prominent highlight of the Intel Foundry Direct Connect event. Intel ...

Ansys has announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These certifications help ensure functionality and reliability of ...

Read through those previous two sentences again and you might catch the meaning behind the “just don’t call it a stick” bit in this writeup’s title; similarly, you might get why last month I wrote: ...

Since gold bumps are used in driver IC packaging, rising gold prices are pushing up material costs for manufacturers. Although current selling prices have not yet reflected this increase, a sustained ...

A new technical paper titled “Real-Time ESD Monitoring and Control in Semiconductor Manufacturing Environments ... This detector has been designed and fabricated in a 0.18- μ m CMOS process. The ...

Andrew Kokes is global marketing leader at HGS, CX professional, product promoter, outsourcing innovation fan—with a focus on what’s next. In today’s marketing landscape, expectations ...

Much attention has been focused on process ... s 3D-IC concept with 14A chiplets packaged on top of SRAM with EMIB bridge technology connecting it to I/Os and surrounded by HBM for L3 caching. Source: ...