Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...

Worse, the most recent CERN implementation of the FPGA-Based Level-1 Trigger planned for the 2026-2036 decade is a 650 kW system containing an incredibly high number of transistor, 20 trillion in all, ...

To enhance analogue and mixed-signal verification, Toshiba has adopted Siemens’ Solido Simulation Suite and Solido Design ...

According to Towards Chemical and Materials Consulting ™, The global 3D printing materials market size was estimated to be ...

Electronic Design Automation (EDA) in analog Integrated Circuits (ICs) has been the focus of extensive research; however, unlike its digital counterpart, it has not achieved widespread adoption. In ...

On October 15, the Third Circuit en banc heard arguments on New Jersey's prohibition on numerous semiautomatic firearms (pejoratively named "assault firearms") and magazines holding over ten rounds.

A new open-source tool is reshaping how engineers design multi-material objects. Charles Wade, a fourth-year PhD student in the Department of Computer Science at CU Boulder, has created a design ...

Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...

“Right now, DoD customers and federal [contractors] often wait 28 weeks or more for a prototype printed circuit board,” says Ramsdell. “They get a batch of 10, and only one or two might work. By the ...

The Walt Disney Co. logo appears on a screen above the floor of the New York Stock Exchange on Aug. 8, 2017. Disney bought a large part of the Murdoch family's 21st Century Fox in a $52.4 billion deal ...

Have you ever imagined turning your ideas into physical objects with just a few clicks? Thanks to tools like Tinkercad, what once seemed like science fiction is now an accessible reality for anyone ...