This New 3D Chip Could Shatter the “Memory Wall” Holding Back AI

Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...
Opinion

The 3D-Flow Architecture Breakthrough: A Universal, Scalable Digital Processor for Real-Time Pattern Recognition in High-Rate Data Streams — A Platform to Save Millions of ...

Worse, the most recent CERN implementation of the FPGA-Based Level-1 Trigger planned for the 2026-2036 decade is a 650 kW system containing an incredibly high number of transistor, 20 trillion in all, ...
New Electronics

Toshiba adopts Siemens EDA software to advance semiconductor design

To enhance analogue and mixed-signal verification, Toshiba has adopted Siemens’ Solido Simulation Suite and Solido Design ...

3D Printing Materials Market Size to Worth USD 31.23 Billion by 2035 - Exclusive Report by Towards Chemical and Materials

According to Towards Chemical and Materials Consulting ™, The global 3D printing materials market size was estimated to be ...
IEEE

Generative AI for Analog Integrated Circuit Design: Methodologies and Applications

Electronic Design Automation (EDA) in analog Integrated Circuits (ICs) has been the focus of extensive research; however, unlike its digital counterpart, it has not achieved widespread adoption. In ...
IEEE

3D-Printed Demultiplexer Circuits Using Suspended-in-Air Grating Couplers for Terahertz Communications

Abstract: Integrated photonic circuits are in great demand for the upcoming THz communications. This work explores 3D printing to realize high-quality, high-refractive-index-contrast integrated ...