RAM Innovations, a R&D and manufacturing services provider and developer of embedded die packaging (EDP) solutions for electronics manufacturing, has been tasked with playing an essential role in a ...
PCB-based packaging for GaN power devices and modules is the subject of a UK government-funded consortium that will develop both technology and an all-UK GaN module supply-chain. The project, ...
Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...
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