Samsung and SK Hynix have continued their head-to-head battle in the NAND flash memory market with the latter taking the lead with a new launch. SK Hynix, the world’s second-largest memory chipmaker, ...

Micron's new fifth-generation 176-layer 3D NAND flash is the same height as its 64-layer memory, but packs in 2.75 times more layers in the same space--a space that's 30% smaller than today's leading ...

The company announced its goals at the recent International Memory Workshop held in Seoul, South Korea. During its keynote speech, KIOXIA explained how 3D NAND flash has rapidly advanced in the last ...

TOKYO--(BUSINESS WIRE)--Toshiba Memory Corporation, the world leader in memory solutions, today announced that it has developed a prototype sample of 96-layer BiCS FLASH™ three-dimensional (3D) flash ...

At Pure Storage’s Accelerate Conference Toshiba presented a flash roadmap and talked about increasing their 3D NAND stack up to 192 layers in the future. All the major flash manufacturers have ...

Samsung’s 7th gen V-NAND flash memory chips will reportedly have a 176-layer configuration. According to a new report from Korean publication The Bell, the company has already made significant ...

BiCS FLASH is based on a leading-edge 48-layer stacking process that surpasses the capacity of mainstream two dimensional NAND flash memory, while enhancing write/erase reliability endurance and ...

Toshiba Memory America, Inc. has been making consistent advancements with its BiCS flash memory technology for the last few years. The company has launched an array of storage solutions leveraging the ...

Toshiba America Electronic Components, Inc. (TAEC) announces the availability of the state-of-the-art BG3 series, its next generation single-package ball grid array (BGA) solid state drive (SSD) ...

The big picture: Micron anticipates the new 3D NAND will be utilized across a range of industries including autonomous vehicles, in-car infotainment systems and mobile storage as well as client / data ...