Integrating multiple bare dice in a system-in-package (SiP) requires a different test strategy from the more common integration of individually packaged dice on a printed-circuit board. The first-pass ...

1. The OSD335x is an example of a complete system fitting into a tiny BGA package. We also discussed the advantages SiP brings to the design and manufacturing of semiconductors and how they can be ...

Using a system-in-package (SiP) rather than system-on-chip (SoC) implementation to address product miniaturization requirements can lead to shorter development cycles with minimal capital investment.

Detection and monitoring of the yield loss mechanisms and defects in product chips have been a subject of extensive efforts, resulting in multiple useful Design-for-Manufacturing (DFM) and ...

We didn’t just take a sip. We took a good long drink of SIP technology in this round of iLabs testing. We gathered more than 50 devices from five SIP server vendors and 13 SIP endpoint vendors to ...