EDN

Mixed-signal memory IC saves board space, speeds designs

Dallas Semiconductor, a wholly owned subsidiary of Maxim Integrated Products (NASDAQ: MXIM), introduces the DS28DG02 memory device with unprecedented integration of mixed-signal and nonvolatile memory ...
Digi Times

The memory industry (6): When line between memory and logic IC becomes blurred

In 1984, Intel decided to exit the DRAM business, which marked the start of technology diversion between memories and logic IC. In hindsight, Intel's decision made sense. Memories and logic IC are ...
NextBigFuture

NEO Semiconductor 3D X-DRAM With 8x the Density Of DDR5 Computer Memory

Neo Semiconductor has announced the world’s first 3D stackable DRAM technology, called 3D X-DRAM, that could revolutionize computer memory. Neo estimates 3D X-DRAM can achieve 128Gb density with 230 ...
Digi Times

Taiwan memory IC design houses gearing up for edge AI boom

Taiwan-based memory IC design houses including Etron Technology and AP Memory have stepped up their deployment in the edge AI market segment, which is expected to grow through 2025. Save my User ID ...
Dataquest

Chinese semiconductor research achieves multiple breakthroughs in memory and IC design

A number of Chinese universities and research institutions have achieved major progress in semiconductor-related fields. These advances span key areas such as memory, power semiconductor and IC design ...