The Compact Model Coalition of the Silicon Integration Initiative (Si2) has issued a call for papers for its inaugural International Compact Modeling Conference (ICMC), scheduled for June 26-27, at ...
As semiconductor technologies advance, device structures are becoming increasingly complex. New materials and architectures introduce intricate physical effects requiring accurate modeling to ensure ...
Chinese artificial intelligence start-up StepFun has unveiled a compact AI model, Step 3.5 Flash, that it says can rival far ...
Keysight Technologies has released the new Machine Learning Toolkit in the latest Keysight Device Modelling Software Suite. This new solution reduces model development and extraction time from weeks ...